期刊名称：IOP Conference Series: Earth and Environmental Science
印刷版ISSN：1755-1307
电子版ISSN：1755-1315
出版年度：2019
卷号：295
期号：3
页码：1-7
DOI：10.1088/1755-1315/295/3/032004
出版社：IOP Publishing
摘要：The structure and basic principle of heat pipe and plate micro heat pipe array are introduced in detail, and the application of FLUENT grid technology and numerical technique is introduced. The thermal conductivity, the phase change and the effect of the liquid filling rate on the heat transfer performance of the heat pipe were simulated by using FLUENT of CFD software. The results show that when the liquid filling rate is 20% ~ 30%, the thermal conductivity of the micro heat pipe starts to rise, reaching 6.11 × 10-5 W m-2 at the highest level. When the liquid filling rate of 30% to 40%, the thermal conductivity of the micro-heat pipe began to decline, which indicates that the best filling rate is when the liquid filling rate is 20 ~ 30. When the temperature of the outer wall of the condensation section is 67.5 °C, the maximum heat flux can reach 8.1 × 105 W m-2.
