期刊名称：Proceedings of the National Academy of Sciences
印刷版ISSN：0027-8424
电子版ISSN：1091-6490
出版年度：2019
卷号：116
期号：51
页码：25484-25490
DOI：10.1073/pnas.1913126116
出版社：The National Academy of Sciences of the United States of America
摘要：A mechanistic understanding of adhesion in soft materials is critical in the fields of transportation (tires, gaskets, and seals), biomaterials, microcontact printing, and soft robotics. Measurements have long demonstrated that the apparent work of adhesion coming into contact is consistently lower than the intrinsic work of adhesion for the materials, and that there is adhesion hysteresis during separation, commonly explained by viscoelastic dissipation. Still lacking is a quantitative experimentally validated link between adhesion and measured topography. Here, we used in situ measurements of contact size to investigate the adhesion behavior of soft elastic polydimethylsiloxane hemispheres (modulus ranging from 0.7 to 10 MPa) on 4 different polycrystalline diamond substrates with topography characterized across 8 orders of magnitude, including down to the angstrom scale. The results show that the reduction in apparent work of adhesion is equal to the energy required to achieve conformal contact. Further, the energy loss during contact and removal is equal to the product of the intrinsic work of adhesion and the true contact area. These findings provide a simple mechanism to quantitatively link the widely observed adhesion hysteresis to roughness rather than viscoelastic dissipation..
