摘要：This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn 3 phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu 6 Sn 5 phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the interface mobility for the IMC/Sn interface, while a uniform IMC morphology is obtained when the Sn grain boundary and IMC/Sn interface mobilities are comparable. For the wavy IMC morphology, a clear effect of the Sn grain size is observed, while for uniform IMC growth, the effect of the Sn grain size is negligible.
