摘要：The purpose of this work was to quantify the thermal bridge effect of vertical diagonal tie connectors in precast concrete sandwich panels (PCSPs). Special interest was in cases where the use of rigid insulation (e.g. PIR) would leave air gaps between insulation boards and diagonal ties, thus intensifying the thermal bridge. A climate chamber experiment using 5 different joint types was performed to gather reference data for CFD model validation. In the experiment, natural convection was observed in joints where no additional insulation was used, i.e. in air cavities. Significantly larger heat fluxes were measured in these cavities compared to insulated joints. The thermal bridging effect was evaluated for a typical PCSP (thermal transmittance without thermal bridges U = 0.11 W/(m²·K)) using CFD software taking into account 3D heat conduction and convection. Simulation results indicate that diagonal ties without adjacent air cavities increased the average thermal transmittance (U-value) of the envelope by 8%, diagonal ties with a 6 mm air cavity – 19...33% and diagonal ties with a 10 mm air cavity – 45...56%. In conclusion, it was found that the joints in insulation caused by diagonal ties affect the overall thermal performance of the building envelope significantly when efforts are not made to fill the air cavities around the connectors.
其他摘要：The purpose of this work was to quantify the thermal bridge effect of vertical diagonal tie connectors in precast concrete sandwich panels (PCSPs). Special interest was in cases where the use of rigid insulation (e.g. PIR) would leave air gaps between insulation boards and diagonal ties, thus intensifying the thermal bridge. A climate chamber experiment using 5 different joint types was performed to gather reference data for CFD model validation. In the experiment, natural convection was observed in joints where no additional insulation was used, i.e. in air cavities. Significantly larger heat fluxes were measured in these cavities compared to insulated joints. The thermal bridging effect was evaluated for a typical PCSP (thermal transmittance without thermal bridges U = 0.11 W/(m²·K)) using CFD software taking into account 3D heat conduction and convection. Simulation results indicate that diagonal ties without adjacent air cavities increased the average thermal transmittance (U-value) of the envelope by 8%, diagonal ties with a 6 mm air cavity – 19...33% and diagonal ties with a 10 mm air cavity – 45...56%. In conclusion, it was found that the joints in insulation caused by diagonal ties affect the overall thermal performance of the building envelope significantly when efforts are not made to fill the air cavities around the connectors.
