摘要：This is the first report on the coating of diamond dicing blades with metallic glass (MG) coating to reduce chipping when used to cut Si, SiC, sapphire, and patterned sapphire substrates (PSS). The low coefficient-of-friction (CoF) of Zr-based MG-coated dicing blades was shown to reduce the number and size of chips, regardless of the target substrate. Overall, SiC, sapphire and PSS were most affected by chipping, due to the fact that higher cutting forces were needed for the higher hardness of SiC, sapphire and PSS. Compared to the bare blade, the MG coating provided the following reductions in chipping area: Si (~ 23%), SiC (~ 36%), sapphire (~ 45%), and PSS (~ 33%). The proposed coating proved particularly effective in reducing chips of larger size (> 41 µm in chipping width), as indicated by an ~ 80% reduction when cutting sapphire. Small variations in kerf angle and depth demonstrate the durability of the coated blades, which would no doubt enhance consistency in dicing performance and extend the blade lifespan. Finite-element modeling revealed significant reductions in tensile stress and elastic–plastic deformation during dicing, thanks to a lower CoF.
