文章基本信息

标题：Author Correction: Effect of FeCoNiCrCu 0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
本地全文：下载
作者：Yu-An Shen ; Chun-Ming Lin ; Jiahui Li 等
期刊名称：Scientific Reports
电子版ISSN：2045-2322
出版年度：2020
卷号：10
期号：1
DOI：10.1038/s41598-020-67126-y
出版社：Springer Nature
摘要：An amendment to this paper has been published and can be accessed via a link at the top of the paper.