摘要：To minimize the risk of rotting damage to wood materials, special antiseptic preparations with biocidal, fungicidal and insecticidal properties are widely used. Many of them contain highly volatile chemicals that are toxic to humans and harmful to the environment. The development of approaches to reduce the emission of harmful substances from wood materials is an important problem in improving the environmental friendliness of construction and finishing materials. The paper describes a method for increasing the biostability of chipboard based on polyvinyl alcohol binder by chemical-free high-temperature treatment (thermal modification). The paper presents the results of experimental studies of vacuum-conductive drying of wall panels made of thermally modified filler. Drying curves for wall panels were plotted depending on various parameters: temperature conditions, different chipboard thickness, and the residual pressure in the vacuum chamber. The work performed revealed that panels with a thermally modified filler dry much faster than those with untreated filler and without the release of chemical compounds harmful to humans and the environment.
