摘要：Reliability prediction is conducted in all phases of the product life cycle. The purpose of these predictions is to identify the potential weaknesses in design,to evaluate the design feasibility,to compare alternative designs,to provide the model for reliability analysis,to track reliability improvement,etc. Reliability of electronic component is predicted by using statistical prediction methods (standards-based),statistical analysis of operation & maintenance data or by performing reliability testing. The article describes statistical prediction methods such as MIL-HDBK-217,RIAC 217Plus,FIDES Guide 2009,which are widely used for predicting the reliability of electronic components. In addition,we have calculated and compared the failure rate of electronic components in military vehicles conducted with the use of these different methods.
