摘要：This essay focuses on the temperature variation law of the center of the target board soldering area at a certain position when the reflow oven starts working as the core discussion. Using the principle of heat conduction, Fourier's law to solve the problem of temperature values and temperature change laws in the center of the soldering area of the target circuit board at different locations under set conditions. As in the actual process, the temperature change in the center of the soldering area is limited to certain conditions, we can use the target planning, prediction methods, to build a model to solve the maximum problem. At the same time we need to consider the quality of the target circuit board, the use of neural networks, genetic algorithms to establish optimization models for target optimization, and ultimately the optimal furnace temperature curve.
其他摘要：This essay focuses on the temperature variation law of the center of the target board soldering area at a certain position when the reflow oven starts working as the core discussion. Using the principle of heat conduction, Fourier's law to solve the problem of temperature values and temperature change laws in the center of the soldering area of the target circuit board at different locations under set conditions. As in the actual process, the temperature change in the center of the soldering area is limited to certain conditions, we can use the target planning, prediction methods, to build a model to solve the maximum problem. At the same time we need to consider the quality of the target circuit board, the use of neural networks, genetic algorithms to establish optimization models for target optimization, and ultimately the optimal furnace temperature curve.
