摘要：Flexible materials with sufficient mechanical endurance under bending or folding is essential for flexible electronic devices. Conventional rigid materials such as metals and ceramics are mostly brittle so that their properties can deteriorate under a certain amount of strain. In order to utilize high-performance, but brittle conventional materials in flexible electronics, we propose a novel flexible substrate structure with a low-modulus interlayer. The low-modulus interlayer reduces the surface strain, where active electronic components are placed. The bending results with indium tin oxide (ITO) show that a critical bending radius, where the conductivity starts to deteriorate, can be reduced by more than 80% by utilizing the low-modulus layer. We demonstrate that even rigid electrodes can be used in flexible devices by manipulating the structure of flexible substrate.
