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  • 标题:Autograph Assisted Mathematics Module Development to Improve Problem Solving Abilities and Mathematic Connection of High School Students
  • 本地全文:下载
  • 作者:Dewi Anggraini ; Edi Syahputra ; Waminton Rajagukguk
  • 期刊名称:Journal of Education and Practice
  • 印刷版ISSN:2222-288X
  • 电子版ISSN:2222-288X
  • 出版年度:2020
  • 卷号:11
  • 期号:35
  • 页码:10-13
  • DOI:10.7176/JEP/11-35-02
  • 出版社:The International Institute for Science, Technology and Education (IISTE)
  • 摘要:This study aims to determine: (1) the level of validity and effectiveness of the autograph-assisted mathematics module to improve the problem-solving abilities and mathematical connection abilities of the students of SMA MAN 1 Deli Serdang, (2) to increase the students 'mathematical problem solving abilities in the application of autograph-assisted mathematics modules, (3) to increase the students' mathematical connection abilities in application autograph-assisted math module.Researchers develop teaching materials in the form of autograph-assisted mathematics modules using the Dick & Carey development model. The module validation was carried out by three experts and two practitioners.
  • 关键词:Development;Mathematics Module;Autograph;Problem Solving and Mathematical Connections
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