期刊名称：International Journal of Distributed Sensor Networks
印刷版ISSN：1550-1329
电子版ISSN：1550-1477
出版年度：2021
卷号：17
期号：5
页码：1
DOI：10.1177/15501477211018346
出版社：Hindawi Publishing Corporation
摘要：Imperfection in a bonding point can affect the quality of an entire integrated circuit. Therefore, a time–frequency analysis method was proposed to detect and identify fault bonds. First, the bonding voltage and current signals were acquired from the ultrasonic generator. Second, with Wigner–Ville distribution and empirical mode decomposition methods, the features of bonding electrical signals were extracted. Then, the principal component analysis method was further used for feature selection. Finally, an artificial neural network was built to recognize and detect the quality of ultrasonic wire bonding. The results showed that the average recognition accuracy of Wigner–Ville distribution and empirical mode decomposition was 78% and 93%, respectively. The recognition accuracy of empirical mode decomposition is obviously higher than that of the Wigner–Ville distribution method. In general, using the time–frequency analysis method to classify and identify the fault bonds improved the quality of the wire-bonding products.
