标题：Experimental Studies of Sealing Mechanism of a Dismountable Microsystem-to-Macropart Fluidic Connector for High Pressure and a Wide Range of Temperature
摘要：As fluidic microelectromechanical devices are developing and often attached to, or embedded in, large, complex, and expensive systems, the issues of modularity, maintenance, and subsystem replacement arise. In this work, a robust silicon connector suitable for high-pressure applications—likely with harsh fluids—in the temperature range of
