文章基本信息
- 标题：Materials Technologies for Thermomechanical Management of Organic Packages
- 本地全文：下载
- 作者：Vijay Wakharkar ; Chris Matayabased Lehman ; Rahul Manepalli 等
- 期刊名称：Intel Technology Journal
- 印刷版ISSN：1535-864X
- 出版年度：2005
- 卷号：9
- 期号：4
- 出版社：Intel
- 关键词：Thermomechanical Stresses;Microelectronic Packages;Thermal Performance;Thermal Expansion Coefficients;Flip-Chip Packages;Thermal Interface Materials
