出版社：SISSA, Scuola Internazionale Superiore di Studi Avanzati
摘要：After a short illustration of the demands of two future applications in the area of pixel detectors,
namely the upgrade of the large hadron collider and the international linear collider, this article
adresses the most basic interconnection problems occuring in building those devices. Selected
technologies are reviewed for the connection of the sensor to the read out chip and the interconnection
of the chips on a detector module. At the end of the article a summary is given.
