摘要：A thermal model to predict the temperature distribution on the electronic boards of Argentinian satellite SAC-C is presented. A simple model of the box that contains the boards provides the boundary conditions for the thermal calculation of the boards itself. The 3D thermal problem of each board was solved with a novel 2D multilayer FEM developed by the authors. This approach is aplicable because no convection colling is present and thermal radiation can be conservatively neglected.
