期刊名称：International Journal on Smart Sensing and Intelligent Systems
印刷版ISSN：1178-5608
出版年度：2011
卷号：4
期号：01
页码：112-124
出版社：Massey University
摘要：In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, and a slot introduced in the path of light source generates diffraction pattern. Then, irradiance loss of the corresponding diffraction pattern at the receiver could be observed, due to the presence of a wire. Simulation and experimental results show that the proposed method with a slot design renders satisfactory performance of wire detection.
关键词：Bonding wire; diffraction; slot; and irradiance.
