摘要：The currently dominant method in the production of wafers is to use slurry wire-saw slicing. This paper reports a new wire-saw slicing technology, namely, semifixed abrasive wire-saw slicing. The traditional smooth wire is replaced by a patterned wire with a textured surface that can help the wire carrying the abrasives. It aims to improve the number of transient fixed abrasives in the machining process. Transient fixed abrasives can produce “scratch-indenting” processes that are similar to fixed-abrasive wire slicing thereby improving the efficiency of the wire-saw cutting. This study focuses on the behavioral mechanics of the abrasive grits in the slurry during the slicing process. The dynamic images of the movement of abrasive grits in the slicing process are obtained by a high-speed camera. At the microlevel, using statistical methods, the behavioral mechanics of the abrasive grits are investigated by changing the slicing parameters. The results contribute toward a more intuitive and profound understanding of the principle of free-abrasive wire sawing.
