期刊名称：International Journal of Soft Computing & Engineering
电子版ISSN：2231-2307
出版年度：2013
卷号：2
期号：6
页码：325-329
出版社：International Journal of Soft Computing & Engineering
摘要：This paper analyzes the stability of carbon nanotube (CNT) and graphene nanoribbon (GNR) based interconnects for future VLSI technology node. We have analyzed both Bode and Nyquist stability of single-wall CNT, multi-wall CNT, GNR, and copper based interconnect systems. The stability analysis is performed for different interconnect systems for 16nm ITRS technology node. It is shown that densely packed single-wall CNT bundle based interconnect has highest gain margin for a wide range of interconnect length (1 m to 100 m) as compared to the other interconnect systems.
