期刊名称：International Journal of Multimedia and Ubiquitous Engineering
印刷版ISSN：1975-0080
出版年度：2012
卷号：7
期号：4
出版社：SERSC
摘要：In recent year, multi-layered semiconductor package is one of the most important technologies to enhance its performance. To bond between each layer of multi-chip package, die-bonding film is known as an effective material. We had developed a novel low-modulus die-bonding adhesive film. Properties of the films are widely changed by the ratio of epoxy resin and acrylic polymer contents. To satisfy the target properties, the influence of various parameters on material properties was examined. However, it is not easy for researchers to find out the formulation which satisfy the targets. To solve the problem, this paper proposes the weak conditioned combinatorial linear programming method (WCCLP). By defining solution area as a function of combination index, the optimum formulations are acquired. This optimization can be done by newly developed user-friendly software. The software is applicable not only to semiconductor related materials but also to any such formulation as paint, medicine and food.
