期刊名称：Journal of Materials and Environmental Science
印刷版ISSN：2028-2508
出版年度：2012
卷号：3
期号：3
页码：452-460
出版社：University of Mohammed Premier Oujda
摘要：The electrochemical, mechanical, structural and thermal behavior of lead-free SnZn9, SnZn9Bi2, SnZn9Bi2Cu2, SnZn9Bi2Ag2solder alloys were investigated by different methods and compared with conventional eutectic tin-leadsolder. Results of differential scanning calorimeter (DSC) analysis showed that alloying of Bi to SnZn9decreases the melting temperature from 198 oC to 195.9 oC and also the alloying of Cu and Ag to SnZn9Bi2 resulted in reducing the melting temperature more to become 194.5oC and 194oC, respectively. The addition of different elements to SnZn9alloy system such as Ag and Cu allows many complex intermetallic (IMC) phases to form as shown by XRD. The electrochemical behaviour of these alloys in 3.5% NaCl solution was studied using potentiodynamic polarization and electrochemical frequency modulation (EFM) techniques and the results obtained are in good agreement
