期刊名称：International Journal of Antennas and Propagation
印刷版ISSN：1687-5869
电子版ISSN：1687-5877
出版年度：2014
卷号：2014
DOI：10.1155/2014/235847
出版社：Hindawi Publishing Corporation
摘要：A low profile chip-package stacked-patch antenna is proposed by using low temperature cofired ceramic (LTCC) technology. The proposed antenna employs a stacked-patch to achieve two operating frequency bands and enhance the bandwidth. The height of the antenna is decreased to 4.09 mm (about /25 at 2.45 GHz) due to the shorted pin. The package is mounted on a 44 × 44 mm2 ground plane to miniaturize the volume of the system. The design parameters of the antenna and the effect of the antenna on chip-package cavity are carefully analyzed. The designed antenna operates at a center frequency of 2.45 GHz and its impedance bandwidth is 200 MHz, resulting from two neighboring resonant frequencies at 2.41 and 2.51 GHz, respectively. The average gain across the frequency band is about 5.28 dBi.
