出版社：Defence Scientific Information & Documentation Centre
摘要：The principles of copper deposition from pyrophosphate electrolytes have been explained. Based on these principles, a method of preparation of plating bath from basic constituents has been described. It was found that copper pyrophosphate is precipitated from solutions of copper sulphatc and potassium pyrophosphate at a pH of 5.0. For maximum efficiency, copper pyrophosphate has to be disolved in potassium pyrophosphate in a weight ratio of 1 : 4 or a total P2o7,: Cu ratio of 7.5 : 1. By using optimum values of anode : cathode area,2.5, pH, 5.0, temperature, 55°C and a cathode curfent density of 0.8 A/dm2, bright, adherent copper electroplates were deposited on electroless copper plated Al2o3, substrates employed in microwave components.
